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[ CAS No. 2386-87-0 ]

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Chemical Structure| 2386-87-0
Chemical Structure| 2386-87-0
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Product Details of [ 2386-87-0 ]

CAS No. :2386-87-0 MDL No. :MFCD00440900
Formula : C14H20O4 Boiling Point : 363.4°C at 760 mmHg
Linear Structure Formula :- InChI Key :N/A
M.W :252.31 g/mol Pubchem ID :16949
Synonyms :

Safety of [ 2386-87-0 ]

Signal Word:Warning Class:N/A
Precautionary Statements:P273-P280 UN#:N/A
Hazard Statements:H317-H402 Packing Group:N/A
GHS Pictogram:

Application In Synthesis of [ 2386-87-0 ]

  • Upstream synthesis route of [ 2386-87-0 ]
  • Downstream synthetic route of [ 2386-87-0 ]

[ 2386-87-0 ] Synthesis Path-Upstream   1~1

  • 1
  • [ 2611-00-9 ]
  • [ 2386-87-0 ]
YieldReaction ConditionsOperation in experiment
94% With phosphotungstic acid; trioctylmethylammonium acetate; phosphoric acid; dihydrogen peroxide; sodium carbonate In water; toluene at 50℃; for 15 h; Inert atmosphere mixer,Reflux condenser,In a flask equipped with a stirrer,12 parts of water was added while purging with nitrogen,0.38 parts of 12-tungstophosphoric acid,0.56 parts of phosphoric acid,Sodium carbonate was added,The pH was adjusted to 5.0.Further, 0.6 part of trioctylmethylammonium acetate (xylene solution of trioctylmethylammonium acetate manufactured by Lion Akzo) was added,After refining the tungstic acid type catalyst,35 parts of toluene was added and dissolved,As a two-layer system solution,The mixture was stirred vigorously at room temperature for 1 hour.Here, equation (1).And 22 parts of the compound represented by the formulaThe solution was heated to 50 ° C.,While stirring,24.8 parts of 30percent by weight hydrogen peroxide water was added,The mixture was further stirred at 50 ° C. for 15 hours as a postreaction.After cooling to room temperature,1 part of 30percent by weight sodium hydroxide aqueous solution,10 parts of 20percent by weight aqueous sodium thiosulfate solution was added and stirred for 1 hour,After 15 parts of toluene was further added,It was left standing.after that,The organic layer separated into two layers was taken out.To the obtained organic layer, 8.8 parts of Hokuetsu HS (phenol · formaldehyde resin beads manufactured by Ajinomoto Fine-Techno Co., Ltd.) which had been washed with methanol in advance was added,The mixture was stirred at room temperature for 2 hours and filtered under reduced pressure.The resulting solution was washed three times with 30 parts of water,Using a rotary evaporator,By distilling off the organic solvent,20 parts of a desired epoxy compound (EP1) was obtained.The obtained epoxy compound was pale yellow,Epoxy equivalent is 130 g / eq. , And the viscosity was 241 mPa · s.The amount of remaining quaternary ammonium salt (gas chromatography) was 50 ppm,The residual tungsten content (ashing method) was 1 ppm.The obtained epoxy compound contained 6percent monoepoxy compound,93percent diepoxy compound,It is 1percent water adduct,Main purity measurement by GPC showed 99percent.
46% With dihydrogen peroxide; acetonitrile In water at 60℃; for 10 h; Examples 2 to 5The reactions were carried out in the same manner as in Example 1 by changing the reaction conditions (liquid composition), and the results are shown in Table 1 together with the results of Example 1. Incidentally, in Example 5, a substrate different from that of Example 1 was used, but the concentration of the substrate was the same as in Example 1, i.e., 0.448 mol. In Example 4 using benzonitrile as the nitrile compound, the conversion ratio was higher compared with other Examples using acetonitrile and the reactivity was good. In Example 5, the conversion ratio was lower compared with Example 1 employing the same synthesis conditions, and the product was monoepoxide only. It was revealed that the reaction selectively occurs with the double bond of the cyclohexene skeleton.
Reference: [1] Patent: JP5748191, 2015, B2, . Location in patent: Paragraph 0063
[2] ChemCatChem, 2014, vol. 6, # 8, p. 2327 - 2332
[3] Patent: US2012/29217, 2012, A1, . Location in patent: Page/Page column 6
[4] Patent: WO2008/2416, 2008, A1, . Location in patent: Page/Page column 20-22
[5] Patent: WO2008/2416, 2008, A1, . Location in patent: Page/Page column 20-22
[6] Patent: US2016/83360, 2016, A1, . Location in patent: Paragraph 0056-0058
[7] Patent: JP5780627, 2015, B2, . Location in patent: Paragraph 0065; 0068; 0073
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