Loren C. Brown; Tyler J. Richardson; Clair F. Lusk; Nickolaus K. Weise; Matthew Laskoski

DOI:

Abstract

A promising high temperature (PN) resin composed of a polyetherketoneketone (PEKK) core bridged by two bisphenol A linkers and end capped with PN groups is presented. This PEKK-PN resin was characterized via differential scanning calorimetry, thermogravimetric analysis, proton nuclear magnetic resonance spectroscopy, scanning electron microscopy, dynamic mechanical analysis, attenuated total reflection Fourier transform infrared, and rheometry. The PEKK-PN resin was evaluated with two different compositions containing 1) 70:30 PEKK-PN to bisphenol A PN (n = 0) and 2) pure PEKK-PN. The 70:30 PEKK-PN resin was mixed with bis[4-(3-aminophenoxy)phenyl]sulfone and exhibited a melt viscosity of 271 cP, much lower than the 657 cP viscosity of the pure PEKK-PN mixture. Void-free PEKK-PN polymers were easily prepared by degassing and curing up to 380°C, resulting in fully crosslinked networks exhibiting thermal stability above 500°C and a 75% char yield. Additionally, the cured PEKK-PN polymer samples displayed good mechanical integrity retaining 50% stiffness at 300°C. This combination of properties suggests these new PEKK-PN resins are excellent materials for high temperature thermosets in composite applications.

Keywords

bisphenol A ; ; resin ; thermoset

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